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Audio playback: 34mW for high performance mode.

Integrated architecture design: heat pipe and GPU actually make contact to provide unequalled heat conductivity. The Snapdragon X16 LTE modem is designed to deliver peak download speeds up to one. 3D performance ready: designed stability during demanding 3D applications. High performance heat pipe with sintered powder wicks: with the industry's best powder-style pure copper heat pipe for ultra efficient thermal conductivity. SLI ready: designed for compatibility with dual card configurations. High-precision die-casting process: uses the latest high-precision die forming technology to increase the thermal conductivity of the material that makes up the heat sink. Similarly, hardware that supported non unified shader model APIs could be based on a unified shader architecture, as is the case with Xenos graphics chip in. Natural convection design: Silent-Pipe II technology artfully uses the temperature difference between the inside and outside of chassis, creating natural system convection. Proprietary front-flow thermal module: the first Dual-slot heat pipe solution to utilize a convection slot at the back of the chassis to increase thermal dissipation.

GIGABYTE Silent-Pipe II Features and Benefits: This is achieved through a unique design that draws cool air in through a new proprietary front-flow thermal module to remove heat from the heat sink on the VGA card. Silent-Pipe II technology that generates natural airflow to provide more efficient cooling without the use of a heat sink or fan.